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DeepX DX-M1 M.2 Module
DeepX DX-M1 M.2 Module

DeepX DX-M1 M.2 AI Module

200 GPU-class TOPS

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DX-M1 AI Chip 25 TOPS 4GB LPDDR5

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Product Highlights:

  • Performance:25 TOPS (INT8)
  • Interface:PCIe Gen3 x4 (Supports Gen 1/2/3 & x1/x2/x4)
  • Memory: 4GB LPDDR5 (5600 MT/s)
  • Power Consumption: 1W (min) ~ 5W (max)
  • Operating Temperature: -40 ~ 85°C
  • Form Factor: M.2 2280(M Key), 22 x 80mm
  • OS Support: Windows 10/11, Linux (Ubuntu 24.04/22.04/20.04 LTS), 

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Matching package

DeepX DX-M1M M.2 AI Module

DX-M1M AI Chip 25 TOPS

2GB LPDDR4x (4266 MT/s)

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Key features

  • AI Performance with 25 TOPS (INT8)
  • PCIe Gen3 x4 (Supports Gen 1/2/3 & x1/x2/x4)
  • 4GB LPDDR5 (5600 MT/s) Memory
  • M.2 2280(M Key), 22 x 80mm
DX-M1 M.2 Module

The DX-M1 M.2 AI Module embodies advanced silicon technology, demonstrating that intelligence can be deployed at the edge, independent of cloud infrastructure. Operating within a power envelope of just 1–5W, it delivers a processing throughput of approximately 200 GPU-class TOPS, enabling edge devices to transition from passive data collectors to autonomous decision-makers through an innovative energy-efficient architecture. Its proprietary memory organization supports concurrent execution of multiple AI models, establishing a new baseline for embedded AI platforms. This integration reduces reliance on costly, high-power computational systems, making sophisticated AI capabilities accessible across a diverse range of devices, industrial environments, and urban infrastructures.

We authored an article discussing the specifications and features of the DX-M1 M.2 and DX-M1M M.2.

Target Applications

  • Edge Cameras Systems
  • Smart Mobility
  • Smart Factory
  • Smart Cities
  • Robotics
  • Drones
  • Edge Computing
  • Smart Homes
  • Smart Retail

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